AF6WL that's exactly what I am talking about
I was wondering how they bond the surface pad to the tracks running underneath without a via. With through hole I know it's just done by electrolysis and plating but on SMD boards they have a solid adhesive layer between each board layer so my thought was that they actually punched holes in the adhesive layer at the needed points and use something like a liquid solder (applied like how they do it with solder mask) to then fill in the holes and after that put on the next layer. I figured the special solder type material flows and bonds all the connection points when they heat up the board or expose it to something. Of course regular via's could also do it but I have noticed on boards with large FPGA chips that there are not enough via's on the board to make all those connections that I see on the schematic so I figured that some off the top layer pads must be multi layer bonded directly.
I will look at that link and see how its actually done, it's been puzzling me for some time now.